Adhesives, Sealants & Elastomers

Achieve gunability and slump control

Addition of DISPARLON® provides thixotropy with good shear thinning for ease of application, gunability and excellent slump control/bead formation. DISPARLON provides a balanced mix of performance benefits for both waterborne and solventborne adhesive and sealant applications.

Effective alternatives to tin catalysts

K-KAT® catalysts are alternatives (or substitutes) to tin and mercury catalysts for isocyanate, blocked isocyanate and moisture cure silane systems. K-KAT catalysts are effective for crosslinking silane terminated polymers while adding improved adhesion.

Latent thermal initiators for epoxy systems

K-PURE® catalysts are 100% solids, latent thermal initiators for epoxy systems. These catalysts initiate reactions for epoxy/epoxy, epoxy/acid anhydride, epoxy/polyol and epoxy/benzoxazine systems. Applications include semiconductor manufacturing, electronic packaging, laminating and industrial/automotive adhesives.

Clarity and improved bond strength

Unique diols that can enhance mechanical properties and improve bond strength. K-FLEX® diols are solventless liquid polyester diols that range in viscosity from 400-12,000 cPs and can add a balance of flexibility while retaining hardness. They are especially suited for adhesives that require good clarity and low color development.

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